Poziv na predavanje: IC Chip and...

Zajednički odjel za elektroničke elemente / poluvodičke integrirane sklopove (ED15/SSC37) i Odjel za električne krugove i sustave (CAS04) Hrvatske sekcije IEEE poziva Vas na online predavanje:                          

IC Chip and Packaging Interactions in Design for SI, PI, EMC and ESD

koje će održati prof. Makoto Nagata sa Sveučilišta Kobe (Japan). Predavanje je organizirano u okviru programa IEEE Distinguished Lecturer i održat će se u četvrtak, 25. veljače 2021. s početkom u 10:00 sati putem MS Teams platforme. Poveznica za pristup predavanju nalazi se ovdje.

Predviđeno trajanje predavanje s raspravom je 60 minuta. Predavanje će biti održano na engleskom jeziku i otvoreno je za sve zainteresirane. Više o predavaču i predavanju možete pročitati u opširnijem sadržaju obavijesti.

Sažetak

Interactions of IC chips and packaging structures differentiate the electronic performance of power delivery networks (PDNs) in traditional 2D and advanced 2.5D and 3D technologies. This presentation discusses their impacts on signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC) and electrostatic discharge protection (ESD), through in-depth Si experiments with in-place noise measurements and full-chip level noise simulations. Test vehicles under study are given in traditional 2D face up and flip chip packaging, 2.5D fan-out wafer level packaging (FOWLP), and 3D chip stacking with through silicon vias (TSVs).

Biografija

Makoto Nagata received the B.S. and M.S. degrees in physics from Gakushuin University, Tokyo, in 1991 and 1993, respectively, and a Ph.D. in electronics engineering from Hiroshima University, Hiroshima, in 2001. He was a research associate at Hiroshima University from 1994 to 2002, an associate professor at Kobe University from 2002 to 2009 and promoted to a full professor in 2009. He is currently a professor of the graduate school of science, technology and innovation, Kobe University, Kobe, Japan. He is a senior member of IEICE and IEEE.

His research interests include design techniques targeting high-performance mixed analog, RF and digital VLSI systems with particular emphasis on power/signal/substrate integrity and electromagnetic compatibility, testing and diagnosis, three-dimensional system integration, as well as their applications for hardware security and safety.

Dr. Nagata has been a member of a variety of technical program committees of international conferences such as the Symposium on VLSI Circuits (2002-2009), Custom Integrated Circuits Conference (2007-2009), Asian Solid-State Circuits Conference (2005-2009), International Solid-State Circuits Conference (2014-2017), European Solid-State Circuits Conference (2020-) and many others. He is chairing the Technology Directions subcommittee for International Solid-State Circuits Conference (2018-present). He is also serving as SSCS AdCom member (2020-). He is currently an associate editor for IEEE Transactions on VLSI Systems (2015-present). He was a technical program chair (2010-2011), a symposium chair (2012-2013) and an executive committee member (2014-2015) for the Symposium on VLSI circuits, and also a chair for IEEE SSCS Kansai Chapter (2017-2018).

Autor: Mirko Poljak
IC Chip and Packaging Interactions in Design for SI, PI, EMC and ESD
25. veljače 2021. 10:00  -  11:00
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