University, research and industrial partners

Integrated Circuits and Electromagnetic Compatibility Lab is involved now or collaborated earlier with several universities, research institutes and companies outside Croatia.

 

Companies:

ON Semiconductor, Belgium - development of RF models of passive components up to the frequencies of 10 GHz; development of transistor models, development of crosstalk models between lines; TEM cell modelling; development and modelling of the IC-Stripline cell for testing of electromagnetic compatibility of integrated circuits; collaboration within the FP6 project ROBUSPIC

ams AG, Austria - collaboration on analog and mixed-signal integrated circuit (IC) design, development of IC measurement and verification procedures, behavioural modelling of analogue electronic circuits in time domain

AVL List GmbH, Graz, Austria - collaboration on development of accurate measurement procedures for high currents 

Bosch, Germany - collaboration on modelling of electronic devices and on the development of models suitable for electromagnetic compatibility simulations; collaboration within the FP6 project ROBUSPIC

Infineon, Germany - automated ESD testing of I/O pins of microcontrollers 

NXP, The Netherlands/Belgium - collaboration within the FP7 project IMOLA 

Henkel, Belgium - collaboration on the development and testing of the planar inductors implemented on flexible substrates; usage and optimization of ferrite layers to improve magnetic properties of inductors; modelling of inductors; collaboration within the FP7 project IMOLA 

CRP, Italy - collaboration within the FP7 project IMOLA 

Philips, Germany -  collaboration within the FP7 project IMOLA 

Hanita, Israel - collaboration on the development and testing of the planar inductors implemented on flexible substrates; usage of ferrite layers to improve magnetic properties of inductors; collaboration within the FP7 project IMOLA 

Cadence, France - development of the methods for modelling of electronic devices and integrated circuits; collaboration within the FP6 project ROBUSPIC 

CamSemi, Cambridge, UK - collaboration within the FP6 project ROBUSPIC 

Locus d.o.o., Zagreb, Croatia - design and modelling of RFID system subcircuits 

 

Universities and research institutes:

KU Leuven, Belgium - University in Leuven and FER actively collaborate on modelling and design of integrated circuits, design of interconnect and modelling of IC packages as well as on the development of new techniques for EMC testing of integrated circuits

IMEC, Belgium - design of digital-to-analogue converter; collaboration within the FP6 project ROBUSPIC; collaboration within the FP7 projektu IMOLA

Portland State University, Oregon, USA - collaboration in the field of radiofrequency (RF) measurements and modelling of RF circuits and interconnect lines on chip and on PCBs 

INSA, Toulouse, France -  collaboration on the development of methods for testing electromagnetic compatibility of integrated circuits

University of Cambridge, UK - collaboration within the FP6 project ROBUSPIC

EPFL, Switzerland - collaboration within the FP6 project ROBUSPIC